project abstracts for electrical and electronics branches

Analysis of High Speed Operation of a VCSEL (Vertical Cavity Surface Emitting Laser)

Abstract:
Lasers are becoming increasingly important in the field of high speed communication. Used in conjunction with optical fibres and photo-detectors, lasers can be used to form reliable, cost effective communication systems that operate at tens of gigabits per second. Traditional in-plane lasers are increasingly being replaced by Vertical Cavity Surface Emitting Lasers (VCSELs) due to their many advantages, including significantly lower manufacturing costs. 
Smart Antennas and Mutual Coupling in Circular Arrays
Abstract:The quest for mobility intensifies, the need for communicating promptly and efficiently at any place and at any time has become the main issue of wireless communications.Throughout the evolution of wireless communication, different types of antenna systems were developed, from omni-directional antenna systems to sectored antenna systems, to meet the demand of increasing capacity. Only recently, with the introduction of the smart or adaptive antenna systems, which brought about a significant increase in channel capacity and range, has our quest for mobility become more feasible.

Metering Dial Back Project with ENERGEX
  Abstract:
With the ever-increasing load demand of electrical energy, it is important to consider all cost efficient alternatives to current practices. However, the current set up of the Meter Data Agency (MDA) limits any reduction in the cost of reading meters. Meter-reading software initiates a call to a modem that is connected via a serial port to a meter. Ninety five percent of these modems are on a GSM network and as such to receive a data call require two numbers: data and voice. 
 
 
3D Integration, Temperature Effects, and Modeling
Abstract:
Practical limits to device scaling are threatening the growth of integrated circuit (IC) technology. A breakthrough architecture is needed in order to realize the increased device density and circuit functionality that future high performance ICs demand. 3D integration is being considered as this breakthrough architecture. In this thesis, the limits to scaling are noted and the feasibility of overcoming these limits using 3D integration is presented. The challenges and considerations, most notably dangerously high chip temperatures, are provided. To address the temperature concern, a mixed-mode simulator that calculates temperature as a function of position on chip is detailed. The simulator captures the important link between individual device and full chip heating. Lastly, circuit simulations and lab experiments are performed to experimentally validate the claims that differences in device activity on chip leads to dangerously high local and overall chip temperatures.